Surface finish:
Minimum of 100 micro inches of gold
DIE ATTACHMENT:
A) Eutectics
AuSn (80/20), melting point at 280°C
AuGe (88/12), melting point at 356°C
B) Conductive Epoxy
https://www.henkel-adhesives.com/us/en/product/electrically-conductive-adhesives/loctite_ablestik84-1lminb.html
https://www.henkel-adhesives.com/us/en/product/die-attach-adhesives/loctite_ablestikqmi529ht-lv.html
The other conductive epoxy is a Dupont 5504 silver filled or similar
C) Sn62 Solder
The Sn62 melting point is 179°C
Note: SLCC will withstand 400°C. The temperature ramps up should not exceed 4°C/Second.
WIRE BONDING:
Thermo compression, Thermosonic and Wedge bonding
Thermo compression, Thermosonic and Wedge bonding
| Thermosonic | 100°C to 150°C | AU |
| Ultrasonic | 25°C | AU |
| Thermocompression | 280°C to 500°C | AU |
Note: Use .0007″ to .001″ diameter gold wire.
Handling, Storage and Shelf-Life of Ceramic Capacitors:
Temperature (10°C to 35°C)
Relative Humidity (40% to 60%)